Xiaomi is gearing up to launch its next-generation foldable smartphone, but the device is not going to follow the traditional naming scheme. Instead of being called the Xiaomi Mix Fold 5, the upcoming foldable will be introduced as the Xiaomi 18 Fold and is officially confirmed to debut in September.
The biggest highlight of the Xiaomi 18 Fold will be Xiaomi’s new XRING O3 chipset, which succeeds last year’s XRING O1. Xiaomi has officially launched its next generation Flagship SoC which they call “AI Flagship Chip”, the Xiaomi XRING O3. The XRING O3 is based on TSMCs 3nm fabrication process with 24 Billion transistors which is 26% increase compared to previous generation XRING O1. According to Xiaomi’s claims, the new chipset has achieved an impressive 5,228,014 points in AnTuTu V11, making it one of the most powerful smartphone SoCs tested to date.
The XRING O3 features a deca-core CPU configuration comprising two C1-Ultra cores clocked at up to 4.35GHz, four C1-Premium cores reaching 3.68GHz, and four C1-Pro cores running at up to 3.15GHz. It also supports LPDDR6 RAM, with memory bandwidth reaching 113.8GB/s.
In Geekbench 6.5, the chipset reportedly scores 3,945 points in single-core and 15,221 points in multi-core testing. While Apple’s A19 Pro maintains an advantage in single-core performance, the XRING O3 reportedly delivers substantially stronger multi-core performance.
Xiaomi has also highlighted significant GPU improvements, with the XRING O3 reportedly outperforming the XRING O1 by 85%, 94%, and 182% across three selected benchmarks. The chipset also surpassed Apple’s A19 Pro in all three tests shared by Xiaomi.
With the Xiaomi 18 Fold set to debut alongside the XRING O3, Xiaomi appears ready to make a serious push into the ultra-premium foldable and flagship smartphone market. If these performance figures translate into real-world usage, the XRING O3 could become a major rival to flagship chipsets from Qualcomm, MediaTek, and Apple.
