Xiaomi is reportedly preparing to take a major leap in the foldable smartphone segment with its next-generation device, which could either launch as the MIX Fold 5 or be branded as the Xiaomi 17 Fold. As competition in the premium foldable market becomes more fierce, the company seems to be shifting focus toward greater vertical integration, starting with its self-developed chip strategy.
A new Xiaomi device with the model number 2608BPX34C has surfaced in a code repository, sparking speculation about its identity. It is codenamed “Lhasa” and could represent Xiaomi’s next flagship foldable. What stands out most, however, is the reported inclusion of a self-developed XRING O3 chip.
Interestingly, Xiaomi may skip the XRING O2 naming altogether, hinting at a possible cross-generation branding strategy. The XRING O3 is expected to be built on a cutting-edge 3nm manufacturing process, placing it among the most advanced mobile chip technologies currently available. This move signals Xiaomi’s ambition to compete more directly with industry leaders who already rely on in-house silicon for performance optimization and ecosystem control.
In an interview earlier this year with CNBC, Xiaomi Group President Lu Weibing revealed that the company plans to release a new self-developed mobile processor every year going forward. This strategy reflects Xiaomi’s long-term ambition to reduce its reliance on third-party chip suppliers and gain greater control over hardware optimization.
The XRING Chips won’t be exclusive only to smartphones; Xiaomi is also exploring broader applications for its upcoming silicon. The company is reportedly planning to integrate its next-generation processors across various smart devices within its ecosystem, including tablets, wearables, EVs, and other IoT products.
