Qualcomm’s upcoming flagship chipset the Snapdragon 8 Gen 3 is in development and the chip will be unveiled later this year. Going by the leaks and rumors, the chip will definitely bring a significant performance upgrade over it’s predecessor, the Snapdragon 8 Gen 2. The new leak suggests that the chip will come with a new CPU architecture and will offer better battery efficiency.
Snapdragon 8 Gen 3 leaked specifications:
The upcoming flagship Snapdragon 8 Gen 3 goes by the codename “SM8650”. The chip is expected to feature one main Cortex X4 core which is clocked at a 3.7GHz. This is not it, as the primary core is paired with five performance cores and two efficiency cores. There is also a new architecture as the new chip will come with the 1 + 5 + 3 CPU architecture. When compared to it’s predecessor, the Snapdragon 8 Gen 2 had a 1 + 4 + 3 CPU architecture.
The chipset is integrated with an updated Adreno 740 GPU for graphical performance and there will be a significant improvement in the graphical performance as well. It is worth noting that the chip will be manufactured by the TSMC which also manufactured it’s predecessor. TSMC is manufacturing the chip on the N4P node up from the N4 node but the fabrication is still based on a 4nm process. The N4P node will offer slightly better efficiency than the N4 node which is used in 8 Gen 2. There are rumors that TSMC is using an N4P node based on 4nm fabrication due to it’s affordability and easiness to manufacture as compared to the 3nm fabrication.
Just like every year, the chip will be unveiled in the last quarter of the year and Xiaomi, Motorola, Vivo and Oppo will be the first to bring a smartphone with the new flagship chipset.
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